Active Solder Alloy Cerasolzer 

• Flux Free Soldering
• Corrosion Free
• Soldering Temperature 150^oC -  290^oC
• Wetting ability to glass and ceramic

Cerasolzer is used in manufacture of electrical parts, to contact electrical / electronically materials and flat glass / metalized glasses because it provides a unique bonding technique that can take the place of commonly used silver baking, indium soldering, molybdenum-manganese and resin (flux) bonding methods.

Glass, Ceramic, Aluminum and Stain-less Steel are commonly known as non-solderable materials with conventional soldering systems. Heating is not enough to overcome this obstacle.

Ultrasonic vibrations in conjunction with heat cause the required effect and delivers the technical break through. This principle is based on the scientifically recognized 'Ultrasonic Cavitational Phenomenon' which is caused by strong ultrasonic penetration.

The Cerasolzer active-solder alloy together with an ultrasonic activated soldering system enables to solder on ‘hard-to-solder’ materials flux free

 Standard Solder

 CS186  1.6mm 150gm/1000gm  186⁰C

 CS224  1.6mm 150gm/1000gm  224⁰C

 CS246  1.6mm 150gm/1000gm  246⁰C

 CS297  1.6mm 150gm/1000gm  297⁰C

 Lead Free (RoHs-conform)

 GS200ALU  1.6mm 150gm/1000gm 200⁰C

 GS155       1.6mm 150gm/1000gm 155⁰C

 GS182       1.6mm 150gm/1000gm 182⁰C

 GS217       1.6mm 150gm/1000gm 217⁰C

 GS220       1.6mm 150gm/1000gm 220⁰C